Exhibition Invitation | SIG Welcomes You to IICIE 2026 – International Integrated Circuit Innovation Expo

Smart manufacturing empowered by precision measurement – driving the “chip” evolution.
From September 9–11, 2026, SIG (precision measurement division) will showcase its full-automatic Vision Measuring Machines, flash comparators, and automated precision inspection solutions at the Shenzhen World Exhibition & Convention Center (Bao’an New Hall). We cordially invite you to visit our dedicated booth at IICIE 2026, where we will explore how high-accuracy measurement technologies underpin the entire integrated circuit (IC) value chain.

Exhibition Background: IC Industry Enters a New Era of Collaborative Innovation

With surging AI computing power demands and continuous chip feature scaling, the IC industry is undergoing a technological revolution from design to manufacturing. In 2026, the former SEMI-e Shenzhen International Semiconductor Exhibition has been fully upgraded to IICIE – International Integrated Circuit Innovation Expo, reflecting the industry’s heightened focus on full-chain synergy and precision manufacturing. From wafer fabrication to packaging and testing, from equipment and materials to EDA tools, every step of yield enhancement relies on high-accuracy, high-efficiency measurement and inspection technologies.

Exhibition Overview: A 340,000 m² Mega Event for Semiconductors & Electronics

IICIE 2026 will be held on September 9–11 at the Shenzhen World Exhibition & Convention Center (Bao’an New Hall). Running concurrently with CIOE (China International Optoelectronic Exposition) and elexcon Shenzhen Electronics Show, the three exhibitions together span 340,000 square metres, forming a comprehensive platform covering the full IC ecosystem. The expo focuses on core themes including IC Chip & Design, Wafer Fabrication & Packaging/Testing, and Compound Semiconductors, showcasing EDA/IP, IC design, wafer manufacturing, assembly & test, equipment, materials, and components. It serves as a professional venue for business matchmaking, international exchange, and brand promotion.

Four Key Benefits for Visitors

✅ Gain Industry Insights – Stay ahead of trends in IC design, advanced packaging, compound semiconductors, and more.
✅ Connect with the Full Chain – Network with over 400 (estimated for the single show) IC upstream and downstream companies, expanding business opportunities.
✅ Participate in Technical Forums – Join concurrent seminars and technical sessions to capture innovative perspectives and market intelligence.
✅ Experience Precision Measurement Live – Witness live demonstrations of SIG’s measurement systems and get free sample testing for semiconductor manufacturing inspection.

SIG: Precision Measurement Empowering “Chip” Manufacturing

At IICIE 2026, SIG will highlight its metrology solutions tailored for IC and semiconductor production scenarios:

l Fully-Automatic Vision Measuring Machine (OMM)

Designed for high-precision workpieces such as semiconductor equipment components, ceramic substrates, and lead frames. With full CNC control and one-click batch measurement, single-part inspection time is reduced to seconds. Measurement data is automatically uploaded and generates SPC statistical analysis reports – helping wafer fabrication and packaging equipment suppliers upgrade from sampling inspection to full-inspection mode, strictly controlling quality at every gate.

l One-Click Flash Comparator (Quick Vision Measurement)

“Flash” speed, simplified operation – just place the workpiece and press the button. The system automatically recognises and measures all geometric dimensions without fixtures or manual edge detection. Ideal for rapid batch inspection of package substrates, precision connectors, and micro-structure feature sizes – a practical tool for improving throughput in semiconductor assembly and electronics production lines.

l Automated Precision Inspection Solutions

From warpage of chip package substrates, coplanarity of lead frames, to flatness and hole-position accuracy of heat-spreading substrates – SIG provides not just a single machine, but a comprehensive process quality control solution covering the entire “design–manufacturing–packaging” workflow. With non-contact, highly repeatable measurement techniques, we help semiconductor manufacturers achieve consistently high yield rates.

Book Your Exclusive Demo Now!

Want more product details? Curious about on-site performance?
Welcome to enquire via WeChat to schedule a dedicated live demonstration and secure your private time slot in advance.

Exhibition Quick Facts

Transportation Guide

Shenzhen World (Bao’an New Hall) is conveniently located near Shenzhen Bao’an International Airport.

Metro: Line 20 directly serves the venue (Guozhan Station, Exits C1/C2) – easy access to all registration halls.

Distance: Only about 7 km from T3 terminal of Shenzhen Airport, making it highly convenient for out-of-town visitors.

We sincerely invite you to visit SIG Booth 16B55 to explore innovative applications of precision measurement in the IC industry.
Reserve your spot now – we look forward to meeting you at IICIE 2026!

Disclaimer: Exhibition data is derived from publicly available industry reports and forecasts for reference only. Product specifications are subject to on-site actuals. SIG reserves the right of final interpretation.