The 2026 IICIE International Integrated Circuit Innovation Expo was successfully held at Shenzhen World Exhibition & Convention Center (Bao’an New Hall) from September 9 to 11, 2026. SIG Sinowon exhibited automatic Vision Measuring Machine, an automated measurement cell integrating flash measuring system with robotic handler, and high-definition video microscope at Booth 16B55. Our team engaged in in-depth technical exchanges with professional visitors across the integrated circuit industrial chain. Although the exhibition has concluded, SIG Sinowon continues to deliver precision inspection solutions to empower semiconductor manufacturing.
Co-located with CIOE China Optoelectronics Expo and elexcon Shenzhen International Electronics Show, this event covers a total exhibition area of 340,000 square meters. It focuses on IC design, wafer fabrication, packaging & testing, compound semiconductors and other core sectors, covering the complete industrial ecosystem including EDA/IP, IC design, wafer manufacturing, packaging test, equipment, materials and components. SIG Sinowon participated in this premier platform for the full IC supply chain, exploring new value of precision geometric dimension measurement together with industry partners worldwide.
The SIG Sinowon booth 16B55 maintained active communication throughout the exhibition, with live equipment demonstrations and sample measurement consultations attracting strong attention from attendees.
At the automatic Vision Measuring Machine area, visitors learned about measurement solutions for high-precision components such as semiconductor equipment parts, ceramic substrates and lead frames. Adopting fully automatic CNC control, this OMM supports one-click batch measurement, finishing inspection within seconds for each workpiece. All measurement data can be automatically exported to generate SPC statistical analysis reports. Under qualified operating conditions, the OMM achieves a measurement accuracy up to 0.6 μm. A calibration certificate issued by the National Institute of Metrology, China was displayed on site (the full report number and calibration scope can be requested from SIG Sinowon), providing third-party metrology verification for the 0.6μm precision specification. This certificate confirms the metrological performance of the tested sample under calibrated conditions and shall not be regarded as official endorsement or warranty. Such micron-level accuracy delivers stable data support for dimensional control, helping wafer fab and packaging equipment suppliers shift from sampling inspection to full inspection.
In the automated precision inspection zone, SIG Sinowon demonstrated an automated measurement unit built around flash measuring system paired with robotic handler. The robot automatically loads and unloads workpieces. The one-touch flash measuring system recognizes parts and completes all geometric dimension measurement tasks without fixture positioning or manual edge finding, forming a closed-loop workflow from material feeding, measurement to data output. This solution fits high-volume rapid inspection of packaging substrates, precision connectors and micro-feature structures. It minimizes manual operation and improves the repeatability and efficiency of production line inspection.
Our engineers also discussed common challenges with visitors, including warpage of IC packaging substrates, coplanarity of lead frames, flatness of heat dissipation substrates and hole position accuracy. The flash measuring system plus robotic handler setup on site represents not only individual measuring equipment, but also holistic process quality control concepts covering design, manufacturing and packaging. Featuring non-contact measurement and outstanding repeatability, combined with automatic loading and full data traceability, this solution supports semiconductor manufacturers to achieve high yield targets.
Equipped with high-magnification optical imaging and professional measurement software, the high-definition video microscope serves as a powerful Video measuring system. It performs non-contact observation and 2D dimensional measurement on chip surfaces, packaging solder joints, wire bonds and microstructures. The system helps detect micro defects such as cracks, contamination, scratches and foreign particles, delivering intuitive evidence for incoming material inspection, process control and failure analysis.
Over the three-day exhibition, SIG Sinowon received numerous professionals from IC design houses, wafer fabs, packaging & test factories, equipment material suppliers and EDA/IP vendors. Our technical team answered questions regarding dimensional inspection, batch measurement, robotic auto feeding, SPC data management and micro defect analysis. Qualified prospects can apply for free sample testing and exclusive demo booking (subject to final confirmation). Multiple enterprises expressed intentions for follow-up technical communication, prototype testing and solution deployment.
The 2026 IICIE has come to a successful close. SIG Sinowon appreciates the organizer, industry partners and every visitor who stopped by Booth 16B55. While the exhibition ends, SIG Sinowon will keep innovating precision measurement and automated inspection technologies. Moving forward, SIG Sinowon will further deepen expertise in precision metrology, providing high-precision, high-efficiency and automated geometric dimension measurement solutions for the entire integrated circuit industry chain.
To download exhibition brochures, schedule equipment demos or apply for free sample measurement, please visit SIG Sinowon’s official website: https://www.sinowon.com, or contact us at +86-769-23184144.
SIG Sinowon | Precision Metrology Empowers Semiconductor Manufacturing
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