Vision + Optical + Laser Hybrid Measurement: SIG Provides Total Geometric Dimension Measurement for PCB Manufacturing

With the rapid development of 5G communications, IoT, and wearable devices, printed circuit boards (PCB) and flexible printed circuits (FPC) are evolving toward higher density, finer pitch, and more layers. At the same time, the industry’s requirement for geometric dimension measurement has become extremely strict – line width tolerance must be controlled within ±5μm, and component placement accuracy directly affects product function and reliability. Facing the inspection demands of multi-layer, high-density PCBs, traditional contact measuring tools are no longer efficient or accurate enough. SIG (formerly Sinowon Instruments) has launched a hybrid vision measuring machine that integrates video measuring system and optical measurement technology, providing a complete geometric dimension measurement solution for PCB manufacturing from raw material to finished product.

1. Core Value of Video Measuring & Optical Measurement

The SIG hybrid vision measuring machine adopts a high-resolution industrial camera and a dual-telecentric optical system, combined with advanced image processing algorithms, to achieve micron-level non-contact measurement. The vision measuring machine quickly captures PCB contours, pad positions, trace widths and other 2D dimensions; the optical measurement function, via a high-magnification zoom lens and programmable multi-angle lighting, clearly reveals tiny feature details. The two methods work together without touching the workpiece, effectively avoiding physical damage to delicate circuits and fragile components – especially suitable for thin, easily deformable FPCs.

2. What Geometric Dimensions Can Be Measured?

Leveraging hybrid video measuring technology, SIG enables comprehensive geometric dimension measurement of PCBs, covering the following core types:

2.1 Flatness & Warpage Measurement

Flatness is a key indicator of PCB board flatness, directly affecting soldering reliability and subsequent assembly accuracy. With an optional laser probe or white-light confocal sensor, the equipment automatically scans multiple height points, calculates flatness values, and outputs a color deviation map, accurately analyzing overall plane deformation and warpage of large PCBs. This is a critical geometric dimension measurement for ensuring PCB quality.

2.2 Optical Dimension Measurement

Includes line width/space, pad size, through-hole (PTH/VIA) diameter and position, component placement coordinates and angular offset, etc. For FPC inspection, it precisely measures via diameter and pad position, avoiding short circuits or signal transmission failures caused by trace misalignment. This is where the OMM (Optical Measuring Machine) capability shines.

2.3 2D Geometric Dimension Measurement

Covers PCB outline length/width, edge distance, hole-to-hole distance, hole-to-edge distance, arc, angle, concentricity, and more. For simultaneous inspection of multiple PCB panels, the equipment quickly identifies each unit and accurately measures external dimensions and key feature positions.

2.4 3D Hybrid Measurement

Optional contact probe or laser sensor enables 2.5D/3D data fusion, measuring board thickness uniformity, solder joint height, step difference, profile, and other 3D parameters.

3. Solving Key Production Pain Points

Pain Point 1 – Low efficiency and high human error
Traditional calipers and profile projectors require manual point-by-point measurement, which cannot keep up with high-volume production. The SIG fully automatic vision measuring machine pre-sets measurement paths and performs unattended batch scanning. One-click start automatically completes dimension measurement of multiple workpieces, with data uploaded and SPC statistical reports generated in real time to monitor process variation.

Pain Point 2 – Inaccurate or incomplete measurement of micro features
Micro traces and miniature components (e.g., 0201, 01005 packages) are difficult to measure with conventional tools. The Sinowon video measuring system offers high repeatability accuracy, combined with an automatic zoom lens and AI edge extraction algorithm. It can extract multiple parameters from a single device within 1 second, ensuring stable and repeatable micro-feature inspection.

Pain Point 3 – Workpiece damage from contact measurement
Thin PCBs and flexible circuits easily deform under contact measurement, leading to inaccurate data. The hybrid OMM (optical measuring machine) uses non-contact optical measurement, eliminating deformation errors caused by physical contact while preventing scratches on delicate solder pads and copper foil surfaces.

Pain Point 4 – Layer-to-layer alignment inspection for high-density multi-layer boards
Drill hole position accuracy in multi-layer PCBs directly affects interlayer connection reliability. SIG equipment precisely measures hole coordinates, ensuring that layer-to-layer deviation is controlled within micrometers – solving a challenge that traditional tools cannot handle efficiently.

Conclusion

The SIG hybrid vision measuring machine – with its high-precision, non-contact, automated hybrid inspection technology – provides a full-process quality control solution for the PCB industry, covering flatness, optical dimensions, geometric dimension measurement, and 3D topography. It helps manufacturers reduce costs, increase efficiency, and improve yield.

For more technical specifications or inspection solutions, please visit the Sinowon official website: www.sinowon.com or contact our support team for a dedicated consultation.