Brief introduction of selective wave soldering defects and prevention
Selective wave soldering defects and their prevention. The main problem that currently affects the soldering process lies in the trend of lead-free soldering conversion and miniaturization. Micro soldering refers to more SMD components on a printed circuit board. Soldering techniques for processing solder joints include more reflow applications. The assembled through-hole components should be automatically soldered to ensure the best quality. The connection method of the component and the electronic board depends on the number of solder joints, but for most products, selective soldering is the best way to replace pallet wave soldering or manual soldering. Welding technology is now quite sophisticated, but it still has typical defects. The lead-free solder that can only be provided locally has a high melting point and requires a higher operating temperature, which increases the risk of certain specific defects, including the following: · solder joint peeling· tailing· tin bridge· tin ball· copper The high temperature of pad dissolving poses no small challenge to the flux. Too little flux may cause welding defects such as false soldering, and too much flux will cause electron migration due to residual flux. This paper will discuss these typical defects and introduce how to optimize process parameters to prevent defects.
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