Sinowon Video Measuring Systems in 3C Electronics Industry Applications

Core Application Scenarios
1. Precision Component Measurement
• Micro-component Inspection: Measures critical dimensions (length/width/aperture/pitch) of mobile SIM slots, connector pins, micro-motor parts, and camera modules with micron-level accuracy.
• FPC Circuit Analysis: Verifies circuit width, pad positioning, and via diameters to prevent signal failures.
• Structural Component Verification: Ensures assembly compatibility through contour flatness/curvature measurements for metal frames, glass covers, and plastic housings.
2. Complex Geometric Dimensioning & Tolerancing (GD&T)
• Validates parallelism, perpendicularity, and concentricity for CNC machined parts and precision molds.
3. Automated Production Line Integration
• In-line Inspection: Robotic integration for automated loading/unloading of batteries and display modules.

Technical Advantages
1. High-Precision & Efficiency
• Submicron accuracy with advanced optics and image processing algorithms.
• Second-level measurement speeds via auto-edge detection and pattern matching.
2. Non-Contact Inspection
• Zero physical damage to soft materials (rubber seals, thin-film switches) or transparent components (glass covers, optical lenses).
3. Multi-Lighting & AI Algorithms
• Adaptive coaxial/ring/polarized lighting systems eliminate glare and shadows.
4. Data Visualization & Traceability
• 3D color mapping for deviation analysis.
• Full data traceability compliant with ISO/IATF standards.

Industry Challenges & Solutions
✓ Miniaturization: Handles Type-C connectors and MEMS sensors with high-magnification optics.
✓ Complex Assemblies: Manages cumulative tolerances in foldable hinges and TWS earphone structures.
✓ Cost Efficiency: Replaces 3-5 QC staff per machine with automated solutions.

Case Studies
• Camera Module Inspection: Lens spacing & bracket concentricity for optical performance.
• Smartwatch Structural Analysis: Ceramic case hole alignment for biometric sensors.
• PCB Solder Inspection: Prevents circuit faults through solder joint analysis.

Future Trends
• AI+IoT Integration: Self-learning measurement strategies with remote equipment monitoring.
• Multi-Scale Quality Control: Combines SEM/laser scanning for nano-to-macro measurements.

Why Choose Sinowon Vision Measuring Machines?
As 3C electronics evolve with AR/VR, foldables, and wearables, our OMM solutions deliver:
✓ 0.5μm repeatability for geometric dimension measurement
✓ Industry 4.0-ready video measuring systems
✓ 30% faster inspection cycles vs conventional CMMs